Tsukineko 2-Piece Kit The Essential Glue Pad of All Kinds
Brand: Tsukineko
Out of stock
- The essential glue pad kit provides a clear water-based adhesive in the form of a stamp pad; no heat setting required; perfect for paper crafting projects using pearlescent powders, chalks, metallic foils, ultra-fine glitter and many other products
- Pad includes a protective inner liner to help prevent premature drying
- Essential Glue refill can also be used directly with applicators such as Tsukineko's Sponge Daubers, Jumbo Daubers, Ink Sweepers, and Fantastix
- Available in kit; kits contain un-inked pads for maximum freshness at time of use; easy control applicator tip makes adding of adhesive a snap; the essential glue refill bottle also sold separately
- Measures 5.8 by 3.36 by 1-inch
Description
Great for rubber stamping, stenciling and direct-to-paper applications! Perfect for use with ultra-fine glitter, chalk, powdered pigments, gold leafing and more! Best results are achieved on vellum and coated cardstock. This is a clear heat free adhesive. This package contains one 4x2-3/4in pad with a 0.5oz/15ml refill. Glue conforms to ASTM D4236. Imported.
Product Information
| Brand | Tsukineko |
| Specific Uses For Product | Art |
| Material | Rubber |
| Compatible Material | Paper |
| Item Form | Pad |
| Special Feature | Glitter |
| Color | Clear |
| Item Package Quantity | 1 |
| Package Information | Bottle |
| Item Volume | 15 Milliliters |
| Unit Count | 1.0 Count |
| UPC | 712353080010 712353080027 |
| Global Trade Identification Number | 00712353080027 |
| Manufacturer | Tsukineko |
| Product Dimensions | 5.8 x 3.36 x 1 inches |
| Item model number | GP000002 |
| ASIN | B000WWKDGW |
| Customer Reviews | 4.4 4.4 out of 5 stars 216 ratings 4.4 out of 5 stars |
| Best Sellers Rank | #104,683 in Arts, Crafts & Sewing (See Top 100 in Arts, Crafts & Sewing) #945 in Art Glues & Pastes #2,267 in Office Glue & Adhesives |
| Is Discontinued By Manufacturer | No |
| Item Weight | 0.48 ounces |
| Date First Available | December 19, 2008 |
